ELECTROLESS NICKEL PLATING ONTO SILICON

Abstract

Contact metallization and interconnectivity of conductors are very important factors in the continuous advancement of very large silicon integrated technology. With size of devices shrinking to submicron devices, normal metal soldering method has been obsolete at fabrication Stage. The need for good electrical contact onto silicon is discussed. A simple but effective method of plating nickel onto silicon is presented and experimental results for its conduction through the junction so formed are shown at different temperatures.